Why select Laser?
PCBA laser depaneling is non-contact process technology, with no mechanical stress, no consumable worn blades, no die cost, no damage to the components, high precision.
Software control, user-friendly, the contour can be easily programmed, and the cutting pattern can be easily defined. The vision system can make accurate marking position recognition. No realignment is required between the switch of different types of panels.
CO2 or UV?
The PCBA laser cutting speed of the CO2 Laser is faster and at a low cost than UV, but CO2 cutting will have more charring on the cutting edge, and the kerf width is larger than the UV process.
The UV laser is 355 nm wavelength, with a “cold marking" method. The laser beam diameter is only 20 μm after focusing. The pulse energy of the UV laser act on the material is in a microsecond. There is no significant thermal influence next to the slit, so there is no damage to the electronic component caused by the heat generated.
UV Laser is suitable for rigid, flexible and rigid&flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass and copper, etc.
PCB Laser Marking
PCB laser marking can mark various characters, symbols and patterns, etc. The characters’ size can range from millimeters to micrometers, which can realize the function of anti-counterfeiting. Besides, laser marking can also process serial numbers and QR codes to record related production information, facilitating the complete traceability and quality control of electronic products.
Compared with traditional inkjet marking, PCB laser marking is more environmentally friendly.
A fully automated PCB Laser marking machine is widely used in the circuit board industry, mainly for assembly line marking operations on integrated circuit boards and semiconductor components, including text or graphic marking. Due to the non-contact processing method, no mechanical pressure is generated. The Laser-focused beam is tiny, which c